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| www..com STPS15L30CDJF Low drop power Schottky rectifier Features A1 K A2 Very small conduction losses Negligible switching losses Extremely fast switching Low forward voltage drop Low thermal resistance High avalanche capability specified ECOPACK(R)2 compliant component K A1 A2 A2 A1 K Description Dual center tap Schottky rectifier suited for switch mode power supply and high frequency DC to DC converters. Packaged in Power QFN, this device is intended for use in low voltage, high frequency inverters, free-wheeling and polarity protection applications. Table 1. IF(AV) VRRM Tj (max) VF(max) Power QFN (6x5) Device summary 2 x 7.5 A 30 V 150 C 0.39 V May 2009 Doc ID 15664 Rev 1 1/7 www.st.com 7 www..com Characteristics STPS15L30CDJF 1 Characteristics Table 2. Symbol VRRM IF(RMS) IF(AV) IFSM IRRM PARM Tstg Tj 1. dPtot --------------dTj Absolute ratings (limiting values, per diode) Parameter Repetitive peak reverse voltage RMS forward current Average forward current Surge non repetitive forward current Peak repetitive reverse current Repetitive peak avalanche power Storage temperature range Maximum operating junction temperature (1) 1 ------------------------Rth ( j - a ) Value 30 10 Tc = 140 C = 0.5 Per diode Per device 7.5 15 75 1 2800 -65 to + 175 150 Unit V A A A A W C C tp = 10 ms sinusoidal tp = 2 s square F= 1 kHz tp = 1 s Tj = 25 C < condition to avoid thermal runaway for a diode on its own heatsink Table 3. Symbol Rth(j-c) Rth(c) Thermal resistance Parameter Per diode Junction to case Total Coupling 1.7 0.7 C/W Value 2.5 Unit When the diodes 1 and 2 are used simultaneously : Tj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c) Table 4. Symbol IR(1) Static electrical characteristics (per diode) Parameter Reverse leakage current Test conditions Tj = 25 C Tj = 125 C Tj = 25 C VR = VRRM IF = 7.5 A IF = 7.5 A IF = 15 A IF = 15 A Min. Typ. 70 0.34 0.44 Max. 1 140 0.48 0.39 V 0.57 0.51 Unit mA mA VF(1) Forward voltage drop Tj = 125 C Tj = 25 C Tj = 125 C 1. Pulse test: tp = 380 s, < 2% To evaluate the conduction losses use the following equation: P = 0.27 x IF(AV) + 0.016 IF2(RMS) 2/7 Doc ID 15664 Rev 1 www..com STPS15L30CDJF Characteristics Figure 1. Average forward power dissipation Figure 2. versus average forward current (per diode) 9 =0.5 =1 Average forward current versus ambient temperature ( = 0.5, per diode) 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 PF(AV)(W) IF(AV)(A) 8 7 6 5 4 3 T =0.2 =0.1 =0.05 2 tp T IF(AV)(A) 0 1 2 3 4 5 6 7 =tp/T 8 9 1 0 10 =tp/T 0 25 tp Tamb(C) 50 75 100 125 150 Figure 3. Normalized avalanche power derating versus pulse duration Figure 4. Normalized avalanche power derating versus junction temperature PARM(tp) PARM(1s) 1 1.2 1 0.1 0.8 0.6 0.01 0.4 0.2 0.001 0.01 0.1 1 PARM (Tj) PARM(25C) tp(s) 10 100 1000 Tj(C) 50 75 100 125 150 0 25 Figure 5. Non repetitive surge peak forward current versus overload duration (maximum values, per diode) Figure 6. Relative variation of thermal impedance, junction to case, versus pulse duration 120 110 100 90 80 IM(A) 1.0 0.9 0.8 0.7 Tc=25C Zth(j-c)/Rth(j-c) 70 60 50 40 30 20 10 0 1.E-03 IM t =0.5 0.6 0.5 0.4 Tc=75C Tc=125C 0.3 0.2 t(s) 1.E-02 1.E-01 1.E+00 0.1 0.0 Single pulse tp(s) 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E-05 Doc ID 15664 Rev 1 3/7 www..com Characteristics STPS15L30CDJF Figure 7. Reverse leakage current versus reverse voltage applied (typical values, per diode) Figure 8. Junction capacitance versus reverse voltage applied (typical values, per diode) F=1MHz Vosc=30mVRMS Tj=25C IR(mA) 1.E+03 Tj=150C C(pF) 1000 1.E+02 Tj=125C 1.E+01 Tj=100C Tj=75C 1.E+00 Tj=50C 1.E-01 Tj=25C 1.E-02 0 5 10 VR(V) 15 20 25 30 VR(V) 100 1 10 100 Figure 9. Forward voltage drop versus forward current Figure 10. Thermal resistance junction to ambient versus copper surface under each lead Rth(j-a)(C/W) 300 20 18 16 14 12 10 8 6 4 2 0 IFM(A) Epoxy printed board FR4 copper thickness = 35 m 200 Tj=125C (Maximum values) Tj=125C (Typical values) Tj=25C (Maximum values) 100 VFM(V) 0 Scu(mm) 0.6 0 200 400 600 800 1000 0.0 0.1 0.2 0.3 0.4 0.5 4/7 Doc ID 15664 Rev 1 www..com STPS15L30CDJF Package information 2 Package information Epoxy meets UL94,V0 In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. Table 5. Package dimensions Dimensions Ref. Millimeters Min. Max. 5.05 6.05 4.68 4.47 1.05 Inches Min. 0.195 0.234 0.180 0.172 0.037 Max. 0.199 0.238 0.184 0.176 0.041 K D1 A G M H L A B 4.95 5.95 4.58 4.37 0.95 J N C D D1 Q F F Chamfer 0.30 x 45 typ. 1.68 typ. 0.41 typ. 0.59 0.63 Chamfer 0.012 x 45 typ. 0.066 typ. 0.016 typ. 0.022 0.026 P B C E G H J K L 0.86 typ. 0.20 typ. 0.41 typ. 0.20 typ. 0.25 typ. 0.71 0.81 0.034 typ. 0.008 typ. 0.016 typ. 0.008 typ. 0.01 typ. 0.028 0.032 D M N P Q Figure 11. Footprint (in millimeters) 0.86 4.47 1.68 0.86 0.712 4.88 Doc ID 15664 Rev 1 5/7 www..com Ordering Information STPS15L30CDJF 3 Ordering Information Table 6. Ordering information Marking Package Weight Base qty 5000 Delivery mode Tape and reel Order code STPS15L30CDJF-TR STPS15L30CDJF Power QFN (6x5) 0.095 g ECOPACK(R)2 4 Revision history Table 7. Date 13-May-2009 Document revision history Revision 1 First issue. Changes 6/7 Doc ID 15664 Rev 1 www..com STPS15L30CDJF Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2009 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com Doc ID 15664 Rev 1 7/7 |
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